EcoBindTM Resin Technology
As the leading global supplier of resins and adhesives to the wood products industry, Hexion understands the need for products that meet or exceed emission standards. For more than 50 years, we’ve been meeting the industry’s needs for high-performance resins. And since the early 1980s, Hexion has helped improve resin technologies and reduce emissions by 80 to 90 percent.
Now we’re taking resin innovation one step further with Hexion's EcoBind resin technology.
Resins featuring our EcoBind technology can be formulated to meet or exceed all global emission standards including California Air Resources Board (CARB), US EPA, TSCA VI, US HUD, European EMB and Japanese standards as well as specifications recommended by the Green Building Council. We offer a range of options for plywood, particleboard/fiberboard and wood adhesive applications.
Hexion has long been a leader in providing innovative and cost-effective solutions to the hardwood plywood industry. Manufacturers are looking for resins that can process quickly on their production lines, while also meeting any emission requirements. Hexion has tapped its global technical resources to provide cutting-edge, EcoBindTM adhesive technologies in a full range of resin systems. Our EcoBind product offerings include:
Ultra-low emitting urea formaldehyde (UF) adhesive systems
Emissions from wood products bonded with urea formaldehyde resins have been dramatically reduced in recent years. Hexion has led the way in targeting emission reductions by focusing on four fronts: resin formulation/composition, manufacturing techniques, methods of resin use and the application of formaldehyde scavengers.
Utilizing EcoBind adhesive technologies, we offer base UF resins systems that meet or exceed all global emission standards including California Air Resources Board (CARB), US EPA, TSCA VI, US HUD, European EMB and other Japanese standards as well as specifications recommended by the Green Building Council with emission levels to 0.03 ppm and below. These products are proven in customer plants, easy to use and cost-effective.
Hexion offers an extensive portfolio of technologies so particleboard and MDF manufacturers can tailor solutions with the specific performance characteristics they need in their end use products, at the appropriate cost. This is known as Hexion's EcoBind technology.
In addition to our high-value, fast-curing urea formaldehyde (UF) base resins and our moisture-resistant melamine-based (MUF and MUPF) base resins, we offer innovative EcoBind solutions so board producers can meet the most stringent “green” construction and formaldehyde emission standards. These include:
Ultra-low emitting urea formaldehyde (UF) resin systems
Controlling board emissions when using UF resins can be accomplished in several ways:
One-part resins incorporating urea and melamine. Hexion currently offers low mole resins to meet E1, E0 and/or Super E0 standards using this technology. Cure rates may be slower than standard UF resins.
Base UF resins with scavenger solutions. Urea based scavenger solutions can be added with a base resin to reduce emissions down to approximately E0.
Scavenger resins substituted for up to 30% of a base UF resin. This technology is typically less expensive than one-part resins or scavenger solutions and can meet E0 and TSCA VI levels at less cost.
Phenol formaldehyde (PF) resins for Fiberboard
We offer low-alkaline, fast-curing PF resin systems for wet or semi-dry process fiberboard.
For manufacturers of engineered wood structural mass timbers, Hexion offers Ecobind adhesives that meet or exceed emission standards. One example is Hexion's Ecobind 6500 resin and Wonderbond™ Hardener M650Y. This adhesive system exceeds all structural durability tests and has achieved the UL GREENGUARD Gold Certification. GREENGUARD Certified products are certified to GREENGUARD standards for low chemical emissions into indoor air during product usage.
